Shenzhen HQ coordinates with Silicon Valley, Singapore, Malaysia, Hong Kong, Tokyo, and Shanghai—supporting localized engagement and fast delivery for on-device AI vision solutions
Multi-core CPU + FPGA imaging base, extensible AI post-processing for medical and industrial endoscopy
HD low-power portable form factor—lowering industrial inspection deployment cost
Fingerprint / PIN + on-device face recognition—production-ready home entry solutions
4K stabilization action-camera form—customizable for outdoor live streaming and field capture
Rockchip RV1106B G2, NPU 0.5 TOPS, 128MB memory, camera FPC interface—for IPC / doorbell on-device AI production
Sigmastar SSC308QE, dual-core Cortex-A32, built-in IPU / IVE, 4K encoding—for HD AI IPC
OV sensor + ISP/SoC, optional onboard NPU—for smart home and security IPC mass production
For line inspection and industrial vision capture—supporting industrial interfaces and production bring-up
AWB / AE / HDR / denoise co-tuning for OV and other sensors with mainstream SoCs
Capture, encode, record, multi-interface output and streaming—embeddable in doorbells and IPC
Freeze / white balance / digital zoom / dual-screen display—paired with rigid-scope camera solutions
Intrinsic/extrinsic calibration and timestamp sync for stereo, ToF / optical-flow fusion bring-up
Real-time object detection / segmentation pipelines with custom training and INT8 quantized deployment
Pretrained model packs for doorbells and IPC—fine-tunable with your own data
On-device plate detection and recognition for smart IPC / parking—board-level production bring-up
Face detection / matching for doorbells, access control, and IPC—with quantization and fine-tuning support
Covering smart home, robotics, retail, industrial, and automotive scenarios—explore full solution pages for details
On-device vision for doorbells, IPC, and home security—integrated detection, recognition, and event triggering.
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Vision-guided grasping and fine manipulation for assembly, sorting, and collaborative end-effectors.
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Footfall analytics and POS vision assistance to improve store efficiency and engagement.
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AOI and automated line inspection—shortening cycles from bring-up to mass production.
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Surround-view / DMS and cabin vision—board engineering and on-device algorithms delivered together.
Learn more >AI R&D depth · Specialized New Enterprise credentials · Integrated vision hardware and algorithms
Covering FPGA, embedded vision, OmniVision driver stacks, and on-device AI; deep platform adaptation for Sigmastar / Rockchip.
Up to 16-layer HDI, SI/PI simulation, and MIPI high-speed optimization; SMT + AOI/X-Ray for stable volume delivery.
AWB/AE/denoise/HDR configured per OV sensor and scene—delivering OEM-grade image quality baselines.
Shenzhen + Singapore dual-site collaboration; typical engineering inquiries answered within 24 hours, with on-site bring-up support.
Latest progress in AI vision and edge intelligence
For doorbells, IPC, and industrial inspection, we refine the train–quantize–board-deploy loop to shorten customer algorithm go-live cycles.
Doorbells, IPC, and industrial inspection move inference to onboard NPUs—imaging and algorithm closed loops become core solution competitiveness.
Robotics and line inspection accelerate adoption of global shutter and multi-camera parallelism—MIPI and sync engineering become key to deployment.
The Shenzhen team focuses on on-device AI vision hardware/software R&D and one-stack delivery
Together with our Singapore company, we also take on overseas projects to meet global customer delivery needs
Schematic → PCB layout (up to 16-layer HDI) → SMT assembly → AOI/X-Ray → image tuning → finished-goods test. One-stop delivery reduces multi-vendor handoff risk.
Long-term collaboration with industry partners to advance AI vision and embedded delivery
